Bachelor’s degree in Electronics Engineering or Computer Engineering. Knowledge in semiconductors design and manufacturing process. Prior knowledge in IC design & EDA tools and flows is a plus! Familiar with DRC (Design Rule Checking) and LVS (Layout vs. Schematic) type verification flows. Preferably has knowledge in IC packaging technologies. Scripting/programming (TCL, python, etc.) skills is huge plus! Familiar with Unix. Enjoy working with customers and in a large and international team environment. International travel is required. Highly developed communication skills, including the ability to present ideas and share knowledge with others. Drive adoption of Xpedition IC packaging products family by executing both pre-sale and post-sale technical activities. Understand the potential customers’ needs to either provide direct solutions or formalize the needs as potential enhancements/defects and feed them back to the engineering teams. Develop and deliver demonstrations and technical presentations. Drive software evaluations and benchmarks by prototyping and documenting Xpedition IC packaging flows using customer data. Help provide customer support (on site and off site) to the already-existing customers’ base. Contribute to technical sales plans and communicate with the account teams on progress and account status. Work with the account technology managers to understand business opportunities and be the technical go to person regarding these opportunities. Provide training for other application engineers and Siemens’s customers. Help provide feedback to the engineering teams regarding the newly introduced features. The Application Engineer is also expected to interface with other Siemens EDA products (Calibre, Aprisa, Tessent, ..) to help build a full advanced packaging design and verification flow.